KVR16LS11/4:

DESCRIPTION

This document describes ValueRAM's 512M x 64-bit (4GB) DDR3L-1600 CL11 SDRAM (Synchronous DRAM), 1Rx8, low voltage, memory module, based on eight 512M x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.35V or 1.5V. This 204-pin SODIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:

FEATURES

• • JEDEC standard 1.35V and 1.5V Power Supply
• • VDDQ = 1.35V and 1.5V
• • 800MHz fCK for 1600Mb/sec/pin
• • 8 independent internal bank
• • Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
• • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• • 8-bit pre-fetch
• • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• • Bi-directional Differential Data Strobe
• • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• • On Die Termination using ODT pin
• • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE ≤ 95°C
• • Asynchronous Reset
• • PCB: Height1.18” (30mm), double sided component
• • Lead Free RoHS Complian

KVR16LS11/8:

DESCRIPTION

This document describes ValueRAM's 1G x 64-bit (8GB) DDR3L-1600 CL11 SDRAM (Synchronous DRAM), 2Rx8, low voltage, memory module, based on sixteen 512M x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR3-1600 timing of 11-11-11 at 1.35V or 1.5V. This 204-pin SODIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:

FEATURES

• • JEDEC standard 1.35V and 1.5V Power Supply
• • VDDQ = 1.35V and 1.5V
• • 800MHz fCK for 1600Mb/sec/pin
• • 8 independent internal bank
• • Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
• • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• • 8-bit pre-fetch
• • Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
• • Bi-directional Differential Data Strobe
• • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
• • On Die Termination using ODT pin
• • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
• • Asynchronous Reset
• • PCB: Height 1.18” (30mm), double sided component